Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1635427 | Rare Metals | 2006 | 5 Pages |
Abstract
Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.% SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.% SiCp heat sink material is 236.2 W.mâ1.Kâ1 and 9.9 à 10â6/K (30-200 °C) respectively. It provides important reference data for future experiments.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Changchun WANG, Guanghui MIN, Suk-bong KANG,