Transient liquid phase bonding of Al 2024 to Ti-6Al-4V alloy using Cu-Zn interlayer

Transient liquid phase bonding of two dissimilar alloys Al 2024 and Ti-6Al-4V using Cu-22%Zn interlayer was carried out at 510 °C under vacuum of 0.01 Pa for various bonding time. In order to characterize the microstructure evolution in the joint zone, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) were applied. The results show that joint formation is attributed to the solid-state diffusion of Cu and Zn into Ti-6Al-4V and Al 2024 alloys followed by eutectic formation and isothermal solidification along the Cu-Zn/Al 2024 interface. The hardness of the joints at the interface increases with an increase in bonding time which can be attributed to formation of intermetallic compounds such as Al2Cu, TiCu3, Al4.2Cu3.2Zn0.7, Al0.71Zn0.29, Ti2Cu, TiAl3 and TiZn16 in the joint zone. Moreover, shear strength of the joint reaches the highest value of 37 MPa at bonding time of 60 min.