Article ID Journal Published Year Pages File Type
1635933 Transactions of Nonferrous Metals Society of China 2014 7 Pages PDF
Abstract
Effect of direct current electric field (DCEF) on corrosion behaviour of copper printed circuit board (PCB-Cu), Cl− ion migration behaviour, dendrites growth under thin electrolyte layer was investigated using potentiodynamic polarization and scanning electron microscopy (SEM) with energy dispersive spectrometer (EDS). Results indicate that DCEF decreases the corrosion of PCB-Cu; Cl− ions directionally migrate from the negative pole to the positive pole, and enrich on the surface of the positive pole, which causes serious localized corrosion; dendrites grow on the surface of the negative pole, and the rate and scale of dendrite growth become faster and greater with the increase of external voltage and exposure time, respectively.
Related Topics
Physical Sciences and Engineering Materials Science Metals and Alloys
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