TLP bonding of dissimilar FSX-414/IN738 system with MBF80 interlayer: Prediction of solid/liquid interface location

Isothermal solidification process of a dissimilar transient liquid phase (TLP) bonding of FSX-414/MBF80/IN738 system was simulated by finite difference method. The TLP joint model was divided into two parts and a moving liquid/solid interface model was used for the parts. Diffusion equations were solved for each half of the joints simultaneously up to the end of isothermal solidification. The completion time of isothermal solidification, concentration profiles and position of the solid/liquid interface for each half were calculated. The intersection of the solid/liquid interfaces of two halves was considered the end of isothermal solidification. To obtain some required diffusion data, TLP bonding of FSX-414/MBF80/IN738 was performed at different temperature and time under vacuum atmosphere. The calculated results show good agreement with the experimental results.