Laser-weldable Sip–SiCp/Al hybrid composites with bilayer structure for electronic packaging

Laser-weldable Sip–SiCp/Al hybrid composites with high volume fraction (60%–65%) of SiC reinforcement were fabricated by compression moulding and vacuum gas pressure infiltration technology. Microscopic observation displayed that the Sip–SiCp/Al hybrid composites with bilayer structure were compact without gas pores and the intergradation between Sip/Al layer and SiCp/Al layer was homogeneous and continuous. Further investigation revealed that the Sip–SiCp/Al hybrid composites possessed low density (2.96 g/cm3), high gas tightness (1.0 mPa·cm3)/s), excellent thermal management function as a result of high thermal conductivity (194 W/(m·K) and low coefficient of thermal expansion (7.0×10−6 K−1). Additionally, Sip–SiCp/Al hybrid composites had outstanding laser welding adaptability, which is significantly important for electronic packaging applications. The gas tightness of components after laser welding (48 mPa·cm3)/s) can well match the requirement of advanced electronic packaging. Several kinds of these precision components passed tests and were put into production.