Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu

Al and N were introduced into copper substrate using plasma immersion ion implantation (PIII) in order to enhance its hardness and oxidation resistance. The dosage of N ion is 5×1016 cm−2, and range of dosage of Al ion is 5×1016–2×1017 cm−2. The oxidation tests indicate that the copper samples after undergoing PIII possess higher oxidation resistance. The degree of oxidation resistance is found to vary with implantation dosage of Al ion. The antibacterial tests also reveal that the plasma implanted copper specimens have excellent antibacterial resistance against Staphylococcus aureus, which are similar to pure copper.