Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1637061 | Transactions of Nonferrous Metals Society of China | 2012 | 6 Pages |
Abstract
The effect of silicon doping on the residual stress of CVD diamond films is examined using both X-ray diffraction (XRD) analysis and Raman spectroscopy measurements. The examined Si-doped diamond films are deposited on WC-Co substrates in a home-made bias-enhanced HFCVD apparatus. Ethyl silicate (Si(OC2H5)4) is dissolved in acetone to obtain various Si/C mole ratio ranging from 0.1% to 1.4% in the reaction gas. Characterizations with SEM and XRD indicate increasing silicon concentration may result in grain size decreasing and diamond [110] texture becoming dominant. The residual stress values of as-deposited Si-doped diamond films are evaluated by both sin2Ï method, which measures the (220) diamond Bragg diffraction peaks using XRD, with Ï-values ranging from 0° to 45°, and Raman spectroscopy, which detects the diamond Raman peak shift from the natural diamond line at 1332 cmâ1. The residual stress evolution on the silicon doping level estimated from the above two methods presents rather good agreements, exhibiting that all deposited Si-doped diamond films present compressive stress and the sample with Si/C mole ratio of 0.1% possesses the largest residual stress of â¼1.75 GPa (Raman) or â¼2.3 GPa (XRD). As the silicon doping level is up further, the residual stress reduces to a relative stable value around 1.3 GPa.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Su-lin CHEN, Bin SHEN, Jian-guo ZHANG, Liang WANG, Fang-hong SUN,