Microstructure evolution of copper doped beryllium thin films

Copper (Cu) doped beryllium (Be) thin films were deposited on silicon substrates by using a simple ion beam sputtering method, which can also realize the varying of Cu doping concentration. Detailed morphological and structural characterizations of the samples clearly disclose a microstructure evolution of films upon doping Cu. Doping Cu can effectively suppress film grain growth, causing a small grain size as well as uniform size distribution. Furthermore, doping Cu affects the crystallographic texture of film, which leads to the formation of more compact film structure. In particular, the surface smoothness of the doped films is significantly improved, which makes them promising candidates for various applications.