Article ID Journal Published Year Pages File Type
1641925 Materials Letters 2016 5 Pages PDF
Abstract

•The thermal diffusivity of ternary Cu90−xSnxSb10 alloys is determined.•The liquidus and solidus temperatures and enthalpy of fusion are measured.•The growth morphologies of primary intermetallic compound are investigated.

Ternary Cu–Sn–Sb alloys are a good candidate for solder materials without Pb element. Therefore, the knowledge of thermodynamic properties and phase transition characteristics of this alloy system is essential not only for the fundamental research but also for the industry applications. In this letter, we have measured the liquidus and solidus temperatures, enthalpy of fusion and thermal diffusivity for ternary Cu90−xSnxSb10 alloys by differential scanning calorimetry (DSC) and laser flash methods, respectively. Moreover, the typical growth morphologies of various intermetallic compounds are characterized. It is found that the primary Cu3Sn, Cu6Sn5, Cu4Sn, Cu3Sb and SnSb phases display faceted growth mode, and develop into long strips or large blocks. By contrast, the primary (Cu) phase forms by non-faceted way into very coarse dendrites.

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Physical Sciences and Engineering Materials Science Nanotechnology
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