| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1643359 | Materials Letters | 2014 | 4 Pages |
Abstract
A diffusion bonding technique free of interlayer and external pressure was introduced, and the bonding pressure was generated due to linear shrinkage of Ti(C,N)-based cermet and thermal expansion of steel. The Ti, Ni, Fe concentrations across the joint evolved gradually and binder-riched surface layer, Fe-Co bonded cermet layer and austenite layer formed successively. The tensile residual stress decreased and the stress concentration region transferred away from the cermet side to the steel side. Diffusion bonding was combined with the liquid phase sintering process, and the cermet substrate need not to be heated twice. Compared with traditional method, the joint strength is improved due to graded microstructure, residual stress decrease and bonding process simplification.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Zhixing Guo, Hua Zhong, Mei Yang, Ji Xiong, Weicai Wan, Mengxia Liang,