Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1643513 | Materials Letters | 2015 | 4 Pages |
Abstract
Synchrotron radiation real-time imaging technology was used for in situ study of dissolution and growth behavior of interfacial Cu6Sn5 intermetallic compound (IMC) in Sn/Cu solder interconnect during reflow soldering. The pre-formed Cu6Sn5 grains dissolved into the liquid solder with decreasing aspect ratio in the heating stage, maintained a thin layer of scallop-type in the dwelling stage, and re-precipitated on the existing Cu6Sn5 grains at a faster growth rate with increasing aspect ratio in the cooling stage. The Cu concentration gradient at the interface is responsible for the aspect ratio variation (corresponding to dissolution and re-precipitation of interfacial Cu6Sn5 grains), which is also supported by the simulation of atomic diffusion in the solder based on Fick׳s second law. The growth behavior was well explained by a proposed model based on the Cu concentration gradient.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
M.L. Huang, F. Yang, N. Zhao, Z.J. Zhang,