| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1643622 | Materials Letters | 2014 | 4 Pages |
•The solder melt was ultrasonic treated in order to decrease the inclusions.•The solder melt was ultrasonic treated in order to refine the microstructure.•The microstructure of the lap joint had a refined structure.•The shear strength of the lap joint increased by using the developed solder.
A novel Er-doped Mg–Zn–Al solder was developed by using ultrasonic vibration technology. The inclusions in the solder were analyzed. The microstructure of the solder and its soldering lap joint was investigated, and the shear strength of the joint was measured. It was found that the inclusions in the solder decreased greatly, the α-Mg phase and Al3Er compound were broken up into granular structure after ultrasonic vibration treatment. The α-Mg phase and Al3Er compound in the soldered joint showed similar structure as that of the original solder. The average shear strength of the soldered joints by using the ultrasonic treated filler metal was almost 1.25 times as large as that soldered by the traditional one.
