| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1648240 | Materials Letters | 2011 | 4 Pages |
Abstract
We investigated the influence of current stressing on a crystallographic microstructure of intermetallics in Cu/Sn/Cu solder joints using electron backscatter diffraction (EBSD). After direct current (DC) stressing at 150 °C for 10 d, the total Sn of the Cu/Sn/Cu was converted into a tri-layer structure of Cu3Sn/Cu6Sn5/Cu3Sn. The Cu3Sn layers that grew on the cathode and anode are asymmetrical during DC stressing. A preferred direction < 010> Cu3Sn along the current direction on the anode was found after current stressing.
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Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Delphic Chen, Cheng-En Ho, Jui-Chao Kuo,