| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1649536 | Materials Letters | 2009 | 4 Pages |
Abstract
The ultrafine grained (UFG) microstructure, mechanical properties and electric conductivity of the Cu alloys severely deformed by accumulative roll bonding (ARB) process were systematically investigated. High density of grain boundaries introduced by the ARB process has significant effect on strengthening but little effect on the electric conductivity. The UFG Cu alloys with submicometer grain sizes can achieve both superior mechanical properties and high electric conductivity.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Naoki Takata, Seong-Hee Lee, Nobuhiro Tsuji,