| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1651752 | Materials Letters | 2017 | 4 Pages |
Abstract
A novel low-temperature solder which consists entirely of two phases of intermetallic compounds is reported. The new solder can be reflowed below 125 °C and yet maintains high-temperature mechanical properties at homologous temperatures exceeding 0.9. Specifically, the new solder exhibits creep resistance and high-temperature retention capability exceeding those of conventional low-temperature solders, and its strength even exceeds that of Sn–4%Ag–0.5%Cu (SAC405) at the same homologous temperatures. This intermetallic solder also exhibits room-temperature ductility comparable to conventional solders. Drastic enhancement of wettability is achieved with addition of active metals.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Daewoong Suh, Chi-won Hwang, Minoru Ueshima, Jun Sugimoto,