Preparation of fine copper powder using ascorbic acid as reducing agent and its application in MLCC

The preparation of ultrafine copper powder with chemical reduction method was investigated. Ascorbic acid was employed as reducing agent. Reaction of CuSO4·5H2O with ascorbic acid at 70 °C gives polyhedron monodispersed ultrafine copper powder. The copper powder having excellent dispersibility was prepared when the pH value was controlled at 6 with aqueous ammonia. Influences of reaction temperature on the efficiency of copper powders were also studied. TG/DTG/DTA of copper powder was discussed with thermal analyzer. As-prepared copper powder was applied in BME-MLCC. The micro-structures of end termination and interface were discussed with SEM and polarized light microscope. The copper end termination has high adhesion force, excellent solderibility behavior and resistance behavior to soldering.