Article ID Journal Published Year Pages File Type
1654315 Materials Letters 2006 4 Pages PDF
Abstract

A new class of polyimide/silica–alumina (PI/SiO2–Al2O3) composite film was prepared by synthesizing ceramic oligomers through sol-gel reaction using tetraethoxysilane (TEOS) and heteropropyl aluminium (HPAl) as the inorganic precursors, followed by incorporating them into polyamic acid (PAA) derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) in N, N-diethlacetanide (DMAc). The chemical structure of the hybrid polyimide film was characterized by FTIR. And the surface morphology characterization and element analysis of the hybrid film were performed with SEM. It turned out that a kind of golden and translucent co-doped polyimide film containing a homogeneous dispersion of SiO2–Al2O3 particles was obtained.

Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
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