| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1654642 | Materials Letters | 2005 | 6 Pages |
Abstract
Stress distribution in solar panel under a temperature field was simulated using an analytical method, and the effect of geometric dimension on maximal stress was investigated. Results showed that the maximal tensile/compress and shear stresses existed in polyimide film and adjacent silicon rubber. Change in the thickness of polyimide film and the adjacent silicon rubber would greatly decrease the shear stress in bonding layers.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Xiaoyan Wang, Hongbin Geng, Shiyu He, Dezhuang Yang,