| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1655894 | Progress in Materials Science | 2015 | 66 Pages |
Abstract
In this article we review lead-containing and lead-free solder systems, and the electronic packaging technologies pertinent to soldering process. Recent research on the effects of MNPs on localized heating, microstructure evolution, mechanical properties, and thermomechanical reliability are summarized.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Siyang Xu, Ashfaque H. Habib, Andrea D. Pickel, Michael E. McHenry,