| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1657176 | Surface and Coatings Technology | 2015 | 6 Pages |
•Data fitting technique with finite difference method characterized several films and thin films.•Permeation rate in an encapsulation system can be detailed with finite difference method.•Desorption of a closed system played like a permeation rate in a measurement.•Dried media conducts inverted penetration exhibiting ultra low permeation rate.•Several years permeation in a prediction used for lifetime approximation for applications
We report a numerical study to define moisture barrier performance of a multilayer barrier stack. Thin film electronic devices require a moisture barrier coating to prevent degradation of the devices. However a required barrier performance is an ultimate level which is indefinable value owing to uncertainness in the metrological control. Using diffusion simulation, we discuss validity of barrier performance in the conventional definition of water vapor permeation rate and the actuality of water permeation into an encapsulated volume. The diffusion simulation predicted that the multilayer barrier-stack shows a window of permeation rate related to environmental moisture, a determinant for measureable limit, detail of moisture diffusion in an encapsulated system. An integrative evaluation method suggested that the barrier performance can be consistently defined from total amount of water permeation. The simulation results were obtained from the calculation of multilayer numerical components which were determined by data fitting with measured data, showed 1 g m− 2 of total permeation in 3 years with 3 dyad barrier-stacks.
