| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1657322 | Surface and Coatings Technology | 2015 | 7 Pages |
•Effect of DTBI on kinetic and morphology of electrodeposition of tin was studied.•Cyclic voltammetry showed that DTBI is not electroactive.•Electrodeposition mechanism of tin depends on the presence of DTBI and the potential.•Reduction of tin ions runs under diffusion control.•Hydrogen evolution was affected by the nature of the working electrode.
Electrodeposition of tin from acidic baths was investigated using S-dodecylmercaptobenzimidazole (DMBI). Cyclic voltammetry measurements indicated that this compound isn't electroactive and changed the electrodeposition mechanism. It is found also that the reduction of Sn2 + ions run under diffusion control and the hydrogen evolution was affected by the nature of the working electrode. In addition, the averages of the effective diffusion coefficients of metal species were determined. Indeed, it is shown that the transfer coefficient, tin diffusion coefficient and electron transfer number depend with the potential. The morphology of electrodeposition of tin was also presented. So, the deposit became more uniform and smooth with the DMBI addition. It is found that the electrodeposition rate of tin and the cathodic current efficiency (P) increased with DMBI.
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