Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1657463 | Surface and Coatings Technology | 2014 | 7 Pages |
Abstract
Antimicrobial equipped surfaces of titanium (Ti-6Al-4V) implants are beneficial to prevent implant-associated infections of total joint endoprostheses and osteosyntheses. Copper (Cu) is well suited for this purpose, since it exhibits a well-known antimicrobial activity and can be found as a trace element in the human body, i.e. it is nontoxic in small concentrations. For this approach plasma immersion ion implantation and deposition (PIII&D) of Cu into Ti was evaluated. The amount and also the depth-profile of implanted and deposited Cu in and on the surface were analyzed by X-ray photoelectron spectroscopy (XPS) and ball cratering tests. The layer morphology was studied using scanning electron microscopy (SEM). The surfaces released up to 3.2Â mmol/l of Cu within 24Â h, measured with atomic absorption spectroscopy (AAS). Such Cu doped and coated Ti implants could be useful for prevention and therapy of implant-associated infections.
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Authors
F. Hempel, B. Finke, C. Zietz, R. Bader, K.-D. Weltmann, M. Polak,