| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1657697 | Surface and Coatings Technology | 2013 | 4 Pages |
Abstract
⺠Cu electroplating with supercritical CO2 (sc-CO2) suspension is proposed by addition of Cu particles to sc-CO2 emulsion. ⺠Dissolution of Cu seed layer originally observed in sc-CO2 emulsion is inhibited in sc-CO2 suspension. ⺠The proposed method is applied in filling of holes having 60 and 70 nm in diameter, and complete Cu filling was obtained. ⺠Cu filled in the holes was found to be either single crystal or twin crystals with [111] orientation. ⺠The filling mechanism should be bottom-up growth.
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Physical Sciences and Engineering
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Authors
Tetsuya Shimizu, Nao Shinoda, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone,