| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1657973 | Surface and Coatings Technology | 2013 | 7 Pages |
Abstract
⺠LSP is the principal element inducing the “metallographic variation” (MV) at elevated temperature. ⺠The affected layer has a higher magnitude of residual compressive stress between 25 °C and 300 °C. ⺠The main mechanism of stress relaxation between 200 °C and 300 °C is the dislocation slip and climb. ⺠Recovery creep is the main relaxation mechanism between 400 °C and 500 °C.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
X.D. Ren, L. Ruan, S.Q. Yuan, H.M. Yang, Q.B. Zhan, L.M. Zheng, Y. Wang, F.Z. Dai,
