| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1658471 | Surface and Coatings Technology | 2012 | 6 Pages |
Abstract
⺠Sn-Ag-Cu ternary alloy deposits were prepared by electrodeposition. ⺠HEDTA was developed as an effective complexing agent for the electrodeposition of Sn-Ag-Cu alloy. ⺠Alkylpolyglucoside was found to be an additive suitable for the electrodeposition of Sn-Ag-Cu alloy. ⺠The effects of complexing agents and additive were investigated by LSV, EIS, XRD and SEM.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Yanfeng He, Xuepeng Gao, Yingying Zhang, Hongmei Xu,