| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1658543 | Surface and Coatings Technology | 2011 | 5 Pages |
Abstract
⺠PEALD-Ir film was prepared as an adhesion layer between Cu and TaN films. ⺠Cu (111) preferential growth was greatly improved by 3 nm-thick Ir thin film. ⺠The 3 nm-thick Ir film remarkably enhanced the adhesion between Cu and TaN barrier.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Seong-Jun Jeong, Yu-Ri Shin, Won-Sub Kwack, Hyung Woo Lee, Young-Keun Jeong, Doo-In Kim, Hyun Chang Kim, Se-Hun Kwon,