| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1658885 | Surface and Coatings Technology | 2011 | 4 Pages |
Abstract
⺠Atmospheric pressure non-equilibrium plasma is a good tool for improving material surface properties. ⺠We applied the plasma treatment with CF4-O2 mixed gasses onto Cu surface to gain wettability of fluxless-soldering with lead-free solder. ⺠The Cu surface was fluorinated by the plasma treatment; and the contact angle of solder on the surface was minimized at the flow ratio of CF4/O2 was 1/9. ⺠We showed here surface fluorination by this treatment improves the wettability of flux-less solder.
Related Topics
Physical Sciences and Engineering
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Authors
Masato Ueshima, Yusuke Nakamura, Shingo Horii, Kazuo Sugiyama,