Reactive sputtering of TiOxNy coatings by the reactive gas pulsing process: Part II: The role of the duty cycle

The reactive gas pulsing process (RGPP) was used to deposit titanium oxynitride thin films by dc reactive magnetron sputtering. A titanium target was sputtered in a reactive atmosphere composed of Ar + O2 + N2. Argon and nitrogen gases were continuously introduced into the sputtering chamber whereas oxygen was injected with a well-controlled pulsing flow rate following a rectangular and periodic signal. A constant pulsing period T = 45 s was used for every deposition and the duty cycle α = tON/T was systematically changed from 0 to 100%. The operating conditions were investigated taking into account the poisoning phenomena of the target surface by oxygen and nitrogen. Kinetics of poisoning were followed from measurements of the total sputtering pressure and titanium target potential during the depositions. Deposition rate and optical transmittance of titanium oxynitride coatings were also analysed and correlated with the process parameters. Pulsing the oxygen flow rate with rectangular patterns and using suitable duty cycles, RGPP method allows working according to reversible nitrided–oxidised target conditions and leads to the deposition of a wide range of TiOxNy thin films, from metallic TiN to insulating TiO2 compounds.