Molybdenum interlayers as adhesion promotors for thin copper films on plasma treated glassy carbon

The adhesion of sputtered Copper (Cu) coatings on plane glassy Carbon (C) substrates can be increased by a Nitrogen-RF-plasma pre-treatment and by use of thin Molybdenum (Mo) interlayers. If the Cu coating is deposited directly on a plasma treated C substrate at room temperature the adhesion of Cu to C is excellent. A following thermal treatment (800 °C, high vacuum, 1 h) reduces the adhesion of Cu to C due to de-wetting of the Cu coating from the C substrate by grain boundary grooving. De-wetting can be suppressed if a 100 nm Molybdenum interlayer is present and the adhesion values are also increased again. This work shall analyse the interface in the C/Cu and C/Mo/Cu sample by analytical Cross Sectional Transmission Electron Microscopy and Secondary Ion Mass Spectroscopy.