| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1662648 | Surface and Coatings Technology | 2007 | 5 Pages |
Abstract
An alternative X-ray diffraction method for micro-area residual stress measurement was proposed by means of the analysis of a single diffraction ring, which was performed on a laboratory X-ray microdiffraction system equipped with a 2D planar detector. The microdiffraction experiments were employed to evaluate the residual stress in sol–gel-derived Pb(Zr,Ti)O3 film before and after Ag electrode deposition. The tensile stresses of about 2.3 GPa and 1.2 GPa were calculated in the micro-area of film without and with electrode, which was related to a top electrode stress relaxation effect.
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Authors
F. Yang, W.D. Fei, Z.M. Gao, J.Q. Jiang,