Article ID Journal Published Year Pages File Type
1665059 Thin Solid Films 2014 5 Pages PDF
Abstract

•LiF/Al stack is an efficient Ohmic contact method for non-heavy doped n-type Si.•The conversion efficiency of cell increases from 4.20% to 6.31%.•The carrier transport mechanism is dipole-assisted tunneling.

This study confirms that a LiF/Al (LiF thickness = 15 Å) stack is an efficient Ohmic contact method for use in p-Ni1 − xO:Li/n-Si heterojunction solar cell applications. The maximal conversion efficiency obtained was 6.31%, which was 2.1% greater compared with that of Al-only electrode cell. Temperature-dependent current–voltage measurements confirmed that the carrier transport mechanism was dipole-assisted tunneling at the interface. The insertion of LiF acted as an effective Ohmic contact method and also assisted the back surface passivation.

Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
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