| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1665208 | Thin Solid Films | 2014 | 42 Pages |
Abstract
Experimentally Cu3Sn forms after Cu6Sn5 in the reaction of Cu and Sn-containing solder. Analysis showed that the interfacial energies of the Cu6Sn5/Cu interfaces should be lower than those of the Cu3Sn/Cu interfaces due to better interfacial coherency. That is the main reason that Cu6Sn5 nucleates before Cu3Sn, even though Cu3Sn has a larger energy of formation.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Kuang-Kuo Wang, Dershin Gan, Ker-Chang Hsieh,