| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1666713 | Thin Solid Films | 2013 | 4 Pages |
Abstract
⺠Identification of Cu-Cu wafer bonding mechanisms by in-situ and post-mortem TEM. ⺠Direct observation of diffusion wedges formation at grain boundaries. ⺠Crystallographic orientation mapping of initial and post-bonding grain structures. ⺠Quantification of grain extension in opposite Cu film.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
M. Martinez, M. Legros, T. Signamarcheix, L. Bally, S. Verrun, L. Di Cioccio, C. Deguet,