| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1667087 | Thin Solid Films | 2012 | 5 Pages |
The fabrication of thin film silicon devices based on solution processes rather than on conventional vacuum processes is of substantial interest since cost reductions may result. Using a solution process, we coated substrates with polydihydrosilane solution and studied the pyrolytic transformation of the material into hydrogenated amorphous silicon (a-Si:H). From thermal gravimetry and differential thermal analysis data a significant reduction in weight of the material and a construction of SiSi bonds are concluded for the pyrolysis temperature Tp = 270 to 360 °C. The appearance of amorphous silicon phonon bands in Raman spectra for films prepared at Tp ≥ 330 °C suggests the construction of a three-dimensional amorphous silicon network. Films prepared at Tp ≥ 360 °C exhibit a hydrogen content near 10 at.% and an optical gap near 1.6 eV similar to device-grade vacuum processed a-Si:H. However, the infrared microstructure factor, the spin density, and the photosensitivity require significant improvements.
► We fabricate hydrogenated amorphous silicon (a-Si:H) films by a solution process. ► The a-Si:H films are prepared by pyrolytic transformation in polysilane solution. ► We investigate basic properties in relation to the pyrolysis temperature. ► Raman spectra, hydrogen content, and optical gap are similar to device-grade a-Si:H. ► Microstructure factor, spin density, and photoconductivity show poor quality.
