| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1667142 | Thin Solid Films | 2012 | 4 Pages |
Transient current profiles, measured while applying voltage pulses to W/TiN/Ti metal lines, showed two different stages. In the first stage, the transient current decreased due to both structural changes associated with Ti/W diffusion and the positive temperature coefficient of resistance of polycrystalline W/TiN/Ti. In the second stage, the transient current remained approximately constant due to the effect of morphological and microstructural changes counter-balanced by the thermal expansion of W near the melting temperature and the latent heat of fusion of W. Asymmetric electromigration and symmetric thermomigration fluxes resulted in the asymmetric metal line failure location near the anode.
► Transient current profiles of W/TiN/Ti metal lines showed two different stages. ► Initially, current decreased due to morphological changes by Ti/W diffusion. ► Later, current remained constant due to thermal expansion and latent heat of fusion. ► Electromigration and thermomigration fluxes resulted in the asymmetric failure.
