Article ID Journal Published Year Pages File Type
1667768 Thin Solid Films 2011 5 Pages PDF
Abstract

Low dielectric (low-κ) materials are of key importance for the performance of microchips. In this study, we show that nanosized cowpea mosaic virus (CPMV) particles can be assembled with poly(amic acid) (PAA) in aqueous solutions via the layer-by-layer technique. Then, upon thermal treatment CPMV particles are removed and PAA is converted into polyimide in one step, resulting in a porous low-κ polyimide film. The multilayer self-assembly process was monitored by quartz crystal microbalance and UV–Vis spectroscopy. Imidization and the removal of the CPMV template was confirmed by Fourier transform infrared spectroscopy and atomic force microscopy respectively. The dielectric constant of the nanoporous polyimide film thus prepared was 2.32 compared to 3.40 for the corresponding neat polyimide. This work affords a facile approach to fabrication of low-κ polyimide ultrathin films with tunable thickness and dielectric constant.

Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
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