Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1667793 | Thin Solid Films | 2011 | 4 Pages |
Abstract
In this paper, a pre-treatment process for electroless copper plating on the ceramics was explored. Due to the catalytic activity of gold nanoparticles, the traditional three-step coarsening-sensitization-activation pre-treatment process has been optimized to a two-step coarsening-activation process. In our study, the following results were observed: electroless copper coating on the ceramics was formed after activating the substrate by gold nanoparticles; a more flat and compact nano-composite coating was also obtained by adding gold nanoparticles to the plating solutions. The mechanisms of pre-treatment and composite plating with gold nanoparticles were discussed.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Hongfang Ma, Zhibao Liu, Ling Wu, Yihan Wang, Xixia Wang,