| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1668068 | Thin Solid Films | 2011 | 6 Pages |
Abstract
In the present work a technique to impart a controlled deformation to a substrate through deposition of a thin film is shown. Such a technique allows film-substrate systems to be tailored with a desired shape for various applications. An analytical model has been applied to calculate the displacements and stresses of a patterned crystalline substrate. Analytical results have also been validated via Finite Element simulations. Si substrates have been patterned with Si3N4 and measurements of the transverse displacement were found to agree with the theoretical predictions.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
V. Guidi, L. Lanzoni, A. Mazzolari,