Low-temperature synthesis of copper conductive film by thermal decomposition of copper–amine complexes

Copper conductive film was synthesized at low temperature onto a glass substrate by thermal decomposition of complexes of copper (II) formate and n-octyl amine in nitrogen atmosphere. The film generated by calcination above 110 °C indicated electrical conductivities, resulting in the lowest resistivity of 2 × 10− 5 Ω cm by calcination at 140 °C. The copper conductive film consisted of spherical copper nanoparticles that were a mixture of large and small particles, which resulted in low volume resistivity.