Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1669114 | Thin Solid Films | 2010 | 5 Pages |
Abstract
Low refractive index silicon oxide films were deposited using atmospheric-pressure He/SiH4/CO2 plasma excited by a 150-MHz very high-frequency power. Significant increase in deposition rate at room temperature could prevent the formation of dense SiO2 network, decreasing refractive index of the resulting film effectively. As a result, a silicon oxide film with the lowest refractive index, n = 1.24 at 632.8 nm, was obtained with a very high deposition rate of 235 nm/s. The reflectance and transmittance spectra showed that the low refractive index film functioned as a quarter-wave anti-reflection coating of a glass substrate.
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Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
H. Kakiuchi, H. Ohmi, Y. Yamaguchi, K. Nakamura, K. Yasutake,