Article ID Journal Published Year Pages File Type
1669114 Thin Solid Films 2010 5 Pages PDF
Abstract

Low refractive index silicon oxide films were deposited using atmospheric-pressure He/SiH4/CO2 plasma excited by a 150-MHz very high-frequency power. Significant increase in deposition rate at room temperature could prevent the formation of dense SiO2 network, decreasing refractive index of the resulting film effectively. As a result, a silicon oxide film with the lowest refractive index, n = 1.24 at 632.8 nm, was obtained with a very high deposition rate of 235 nm/s. The reflectance and transmittance spectra showed that the low refractive index film functioned as a quarter-wave anti-reflection coating of a glass substrate.

Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
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