Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1669329 | Thin Solid Films | 2010 | 4 Pages |
Abstract
The formation of Ni silicides on Si1 â yCy (y = 0.01 and 0.018) epilayers grown on Si(001) has been investigated. The presence of C atoms was found to significantly retard the growth kinetics of NiSi and enhances the thermal stability of thin NiSi films. For Ni(11 nm)/Si0.982C0.018 samples, the process window of NiSi was shifted and extended to 450-700 °C. Moreover, there was an additional strain introduced into the Si1 â yCy epilayers during Ni silicidation. This work shows the potential of Ni silicidation on Si1yCy for device applications.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
S.W. Lee, S.H. Huang, S.L. Cheng, P.S. Chen, W.W. Wu,