| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1670160 | Thin Solid Films | 2008 | 7 Pages |
Abstract
Modified Yoldas sols can be used to prepare crack-free well adherent layers on different substrate materials such as soda–lime glass, corundum and metal (IN-718). These layers having thicknesses of 0.6 µm are strain tolerant and withstand thermal cycling between 810 °C and room temperature. Introducing alpha-Al2O3 filler particles into modified Yoldas sols allows the preparation of thicker layers of 1.6 µm, which as well can be thermally cycled without noticeable delaminations. Chemical bonding seems to be the predominant layer bonding mechanism.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
M. Dressler, M. Nofz, R. Saliwan-Neumann, I. Dörfel, M. Griepentrog,