Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1670431 | Thin Solid Films | 2010 | 6 Pages |
We report results from an investigation into the nature and extent of carbon incorporation into aluminum oxide thin films deposited from the pyrolysis of dimethylaluminum isopropoxide via high-vacuum chemical vapor deposition. The chemical nature and distribution of carbon in films deposited in the 417–659 °C temperature range were investigated through X-ray photoelectron spectroscopy and Auger electron spectroscopy. Carbon composition increased with increasing deposition temperature, up to approximately 8 at.% at 659 °C. Carbon in films deposited at 477 °C was bonded only to oxygen or carbon, but films deposited above 538 °C also contained metal carbide-like bonding. Carbon content in films deposited on hydrogen-terminated Si (100) substrates increased toward the film–substrate interface, but no silicon–carbon bonding was observed.