Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1670670 | Thin Solid Films | 2010 | 5 Pages |
Abstract
We performed RBS, infrared (IR) and C–V measurements in order to follow the evolution of Xe, bubbles/cavities and other defects (with a focus on NBOHC: non-bridging oxygen hole center) and dielectric constant (k), in high dose Xe implantation in SiO2. As-implanted sample provides the lowest value of k which increases with post thermal annealing. In the meantime, the concentration of negatively charged defects decreases with annealing while Xe out-diffuses after annealing at 1100 °C leaving Xe free cavities in the sample. By combining these results one can determine the contribution of nanoporosity in dielectric constant evolution.
Related Topics
Physical Sciences and Engineering
Materials Science
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Authors
A. Naas, D. De Sousa-Meneses, B. Hakim, G. Regula, M.F. Beaufort, A. Belaidi, E. Ntsoenzok,