Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1672646 | Thin Solid Films | 2007 | 5 Pages |
Abstract
A Si–Ar plasma is produced using a RF discharge by an internal coil, which is accompanied by DC sputtering, for the purpose of forming novel Si-fullerene compound materials. According to the analysis of the fullerene-C60 after Si–Ar plasma ion irradiation, mass peaks corresponding to Si-heterofullerenes (SiC59, Si2C58 and Si3C57) are observed.It was also found that the method of introducing sublimated C60 into the Si–Ar plasma using a C60-oven resulted in an increase in the formation efficiency of SiC59.
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Authors
T. Hirata, R. Suzuki, R. Hatakeyama,