Article ID Journal Published Year Pages File Type
1672913 Thin Solid Films 2008 7 Pages PDF
Abstract

By covering amorphous silicon (a-Si) with a thin metal film, it is possible to lower the crystallization temperature of the a-Si (typically around 800 °C when using ramp anneals) to levels which can be used in a manufacturing process. This phenomenon of Metal Induced Crystallization (MIC) has been reported previously for Ni, Au and Al. In this work, in-situ X-ray Diffraction was used to study the MIC process for 20 different metals (Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Al). The 7 metals which lower the crystallization temperature the most are Ni, Pt, Pd, Cu, Au, Al and Ag. The crystallization kinetics were studied in detail for these 7 materials. In order to explain the MIC process, two models where used depending on the interaction of the metal with Si (eutectic or compound forming).

Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
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