Investigation of particle reduction and its transport mechanism in UHF-ECR dielectric etching system

Control of particle transport was investigated by using a UHF-ECR etching apparatus with a laser particle monitor. The particles, which float at a plasma-sheath boundary, fall on a wafer when the plasma is turned off. These floating particles can be removed from the region above the wafer by changing the plasma distribution. We measured the distribution of the rotational temperature of nitrogen molecules across the wafer to investigate the effect of the thermophoretic force. We found that mechanisms of particle transport in directions parallel to the wafer surface can be explained by the balance between thermophoretic and gas viscous forces.