Article ID Journal Published Year Pages File Type
1673085 Thin Solid Films 2008 5 Pages PDF
Abstract
Hybrid thin films have been deposited on silicon substrates under several conditions such as different annealing temperatures and RF power by plasma enhanced chemical vapor deposition method using single molecular precursors. The result of the FT-IR measurement showed that the plasma polymerized thin films have highly cross-linked density with increasing RF power and annealing temperature. An impedance analyzer was utilized for the measurements of I-V and C-V curves. From the electrical properties measurements, the lowest dielectric constant and best leakage constant were obtained to be 2.26 and 10− 9 A/cm2 at 1 MV/cm, respectively. Also, the mechanical properties of the films were determined with nano-indentation.
Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
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