Ion beam sputter deposited TiAlN films for metal–insulator–metal (Ba,Sr)TiO3 capacitor application

The present study evaluated the feasibility of TiAlN films deposited using the ion beam sputter deposition (IBSD) method for metal–insulator–metal (MIM) (Ba,Sr)TiO3 (BST) capacitors. The BST films were crystallized at temperatures above 650 °C. TiAlN films deposited using the IBSD method were found having smooth surface and low electrical resistivity at high temperature conditions. TiAlN films showed a good diffusion barrier property against BST components. The J–E (current density–electric field) characteristics of Al/BST/TiAlN capacitors were good, with a high break down electric field of ± 2.5 MV/cm and a leakage current density of about 1 × 10− 5 A/cm2 at an applied field of ± 0.5 MV/cm. Thermal stress and lateral oxidation that occurred at the interface damaged the capacitor stacking structure. Macro holes that dispersed on the films resulted in higher leakage current and inconsistent J–E characteristics. Vacuum annealing with lower heating rate and furnace cooling, and a Ti–Al adhesion layer between TiAlN and the SiO2/Si substrate can effectively minimize the stress effect. TiAlN film deposited using IBSD can be considered as a potential electrode and diffusion barrier material for MIM BST capacitors.