Deposition of dielectrics using a matrix distributed electron cyclotron resonance plasma enhanced chemical vapor deposition system

We have studied the deposition of silicon oxide, oxynitrides and silicon nitride in a novel, scalable, low-pressure high-density plasma system based on the ECR effect and the matrix arrangement of microwave antennas. Silane, nitrogen and oxygen gases were used as precursors. Films were deposited onto different heated and unheated substrates, including silicon, glass and polymer. The influence of the magnetic field configuration, gas flows, reactor pressure, microwave power and radio frequency bias on the uniformity and properties of the films was studied. Ex-situ and in-situ UV-visible spectroscopic phase-modulated ellipsometry and FTIR spectroscopy were used to study the properties of materials and the uniformity of the depositions, along with electrical measurements to evaluate the dielectric properties of the films. Optimizing the magnetic field configuration and applying an RF bias, we were able to achieve an uniformity better than 3.3% across the 200 mm wafers. Stoichiometric silicon oxide films with index values matching that of thermal silica were grown on unheated substrates with rates exceeding 2 nm/s.